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Get Switched On to PVD for SiC Power
In this webinar you'll learn how Sigma® fxP physical vapor deposition (PVD), already well-established in manufacturing silicon power devices, on wafer sizes up to 300mm, can also be used to deposit on SiC wafers at ≤200mm, for both front-side, and back-side metallization. The presentation will give details of how SPTS Sigma® PVD technology overcomes various challenges which can affect yields in SiC power device manufacturing, including eliminating whiskers during thick metal deposition, optimizing film thickness uniformity and repeatability of Ni films for silicide formation, avoiding contamination, active-face protection and stress control.

Dec 2, 2020 05:00 PM in London

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Nick Knight
PVD Product Manager @SPTS Technologies
Nick Knight has more than two decades of experience in the semiconductor capital equipment and related industries. He first joined Electrotech in 1995 as an Equipment Engineer working with PVD products, working in Asia, Europe and US. In 2001, he joined STS in the role of Regional Service Manager for Asia, and in 2003 joined the Marketing team as an Etch Product Marketing Manager. In 2010, following the formation of SPTS Technologies, Mr. Knight went back to PVD product lines as a Product Manager.