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Deep trench measurement with the Zeta 3D Optical Profiler
High aspect ratio, deep trench applications are challenging for many metrology characterization techniques. For scanning probe microscopy, the aspect ratio often exceeds the capability of the probe or the measurement range or both. Cross-section SEM is capable, but destructive. The Zeta optical profiler provides a non-destructive method to measure deep trench depth. In this webinar you will find the technology behind the optical metrology solution for high aspect ratio, deep trench applications.

Jul 13, 2021 10:00 AM in Pacific Time (US and Canada)

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