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Through Glass Measurements of Surface Topography
Measurement of structures such as microfluidics devices requires the capability to measure device dimensions underneath a cover glass. Join Applications Development Engineer Kurt Rubin for a discussion on measuring microfluidic channel height and width, both before and after encapsulation, to quantify structural changes due to induced stress from the encapsulation process. Kurt will also cover specific measurement requirements for these applications, including corrections for changes in the medium, high signal, and also the use of compensation objectives.

Oct 19, 2021 10:00 AM in Pacific Time (US and Canada)

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Kurt Rubin
Applications Development Engineer @KLA Instruments
Kurt Rubin is an Applications Development Engineer at KLA Instruments where he focuses on advanced optical and electrical measurement and modeling. He has an extensive background in the invention of new optical, electrical and magnetic devices, materials and the development of new processes to fabricate them. He is an inventor of fundamental technology underlying multilayer optical storage and high-speed reversible memories. He holds 60 patents and degrees in physics and materials science from MIT, University of Washington and Stanford University.