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Defect reduction on GaAs, InP and other compound semi wafers for communications & sensing applications using Candela®
Compound semiconductor materials like GaAs and InP are quickly spreading into an array of communications and sensing applications like VCSEL, LIDAR, RF, 5G, Datacom, High speed electronics etc. These modern applications require higher stability and reliability from semiconductor devices, hence semiconductor wafer quality is extremely critical. This webinar provides an insight into how Candela® technology can be used as a process control solution for reduction of defects on various compound semi wafers used for communications & sensing.

Nov 18, 2021 08:00 AM in Pacific Time (US and Canada)

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